Pin 6 did not receive a thermal because the pour has no way to connect. It is blocked by tracks. It needs to be corrected.i can see them. some have two and others have more. i assume its because of room and that there are existing tracks going to the pad.
i did get an error when i added the top pour layer. A single pad U3.6 (pin6) did not receive any thermals. the images below show the same area with each layer. is this a problem? the green image is the bottom layer, blue is the top, then one shows both. I can see that the pours did alter my tracks. i can see many tracks in the image that is showing both layers. All very interesting. i hope i have provided you with enough detail to see that i have done a good job here and most importantly that the issue with pin6 is really an issue. it is a DIP socket and not a component.
It would be easier for me to help if you could zip up and post your PCB, schematic, and project file.
And I'll take a look.
If I can I'll fix it and upload. Then we can discuss further