It is a Power Amplifier and its bottom has its thermal pad that must be soldered to a heatsink somehow. Thermal glue?audioguru ... perhaps mounting that little begger upside down and connecting with thin wires ..
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It is a Power Amplifier and its bottom has its thermal pad that must be soldered to a heatsink somehow. Thermal glue?audioguru ... perhaps mounting that little begger upside down and connecting with thin wires ..
That happens with every leadless package I can think of that has contacts on the side (not BGA). Allows excess solder somewhere to go so there is more tolerance for bad paste placement.There are tiny "side pads" where the bottom solder pads fold around the edge and up the sides for a whopping 0.2mm.
Guess you would have to provide some pressure on the pad for that to work. If its not too big a dissipation required then perhaps a small DIY copper heat sink soldered to the pad... just a thought.bottom has its thermal pad that must be soldered to a heatsink somehow. Thermal glue?
What kind of wire did you use for the wi-fi device? I always have problems when I try this method!Yip, ICs are tending to invisible. As a hobbyist I have found that breakout boards and "precision" soldering are now part of life (I'm convinced I could be a surgeon)
You can get through-hole sockets similar to those. I used a through hole socket for a 44 pin PLCC high voltage driver IC on my Nixie frequency counter board:Maybe this surface mount technology will become more attractive for experimenting when SMD to THT adapters will arrive on the market (not only for ICs, but also for smd capacitors and other smd components). I mean a socket where you can directly place the component without needing to solder and desolder it, just like in this case:
so that experimenting on breadboard with smd will become less time-consuming.
I agree with you MrAl. Surface mount technology has it's advantages too. What I meant is that experimenting with it is not so easy, especially when you need to replace parts (yikes). It has been a period when I wanted to work with smd too (training myself at soldering) and I have seen that soldering a smd component is quite easy, even with a hot soldering iron. I think I have learned a secret: if you set a high temperature and you are quick enough when soldering, the part heats LESS than in the situation of a lower temperature and a longer time. As for making PCBs, I need a lot more practice...Hello,
You know what they say: The only thing that doesnt change about life is that life always changes.
I've only recently started to use SMD again, but only once in a while. I did not have to use bga yet though.
One thing i must say is that if you are going to do SMD you need a PC board with the right pattern to start with. Without that, it just doesnt work. If you can make your own board then that's cool too, but it has to have an accurate pattern.
Solder paste does help. When it melts it 'finds' the pins due to adhesion or cohesion and surface tension. It's amazing to watch. When the paste is applied it looks like it might solder all the pins on one side together forming one big short circuit, but it doesnt do that, it separates as it distributes itself between all the pins when it heats up.
I've also used deadbug style for 0.05 inch pitch IC's with #32 AWG wire, but it looks like crap when it's done.
I also miss the days of the 741 although i would not use that particular chip anymore either. My first amplifier was with the ua701 op amp. The one i had had a metal top but was still a dual inline DIP package. Used it with two transistors for a power amplifier.
Life always changes. Unfortunately that is in almost all areas of life too. I guess we have to look at the bright side, where we can build much smaller circuits if we HAVE to.
Liberal amounts of liquid flux should give you the answer."Drag soldering" is a good technique to learn. First time I tried it, it worked perfectly. Never been able to get it right since.
Liberal amounts of liquid flux should give you the answer.