It might become a problem if mains is involved because of insulation distance.
In that case it's up to the user to modify the ground fill or omit it around the relay terminals. For short traces like in this example the load could take up to 8A without problems.
It does not matter if high or low current flows via the relay, voltage is what matters, starting to arc between traces and pads if it's high enough.
Nano technology is not necessary for a clean solder joint with relatively bulky pads.
The ground fill modification took me two minutes.
And yes, I'm using Eagle.