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well I dunno.
probably mean something to an Eupec manufacturer - what die used, what grade of silver solder, wire bond technique... or it just could be some random letters to distinguish a part in their huge portfolio w.r.t. the competition
But as far as you or I our concerned all the info really needed is in the datasheet, unless you work for SEMILAB and want to find out why your modules are crap?
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