ThomsCircuit
Active Member
Example. I do like this guyLike when the components pad is covered by the component so a paste is applied then it is heated from underneath to melt the solder.
Example. I do like this guyLike when the components pad is covered by the component so a paste is applied then it is heated from underneath to melt the solder.
I noticed. It really explains not so much the calculations but the methods and how to apply this on my pcb boards with the design spark software.. All the feedback has explained a great deal. I am grateful for this group your input.Note that there are both VIAs arrays underneath the IC and in the connected copper areas above and below, to provide better heat transfer to the underside ground plane.