I was just curious about something, when soldering through hole components, you have to heat the pad and the lead so the solder will bind to both for the joint to properly form (I assume the same is true for reflow also since both the pad and solder are heated). But in drag soldering it just seems that only the solder is heated? You drag the ball of solder on the tip along the pins so the solder forms overtop of the pin and pad...there is insufficient heating of the pin and pad, so why does it work?
Are there different mechanical requirement for throughhole and SMD or something that allows that to work? Am I missing some detail?
Are there different mechanical requirement for throughhole and SMD or something that allows that to work? Am I missing some detail?
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