I think it would be useful for a CPU thermal module if it were designed properly, CPU's don't heat up over their entire surface area uniformly, the math modules get quiet hot where something like the sections that contain cache memory heat up uniformly where some bus or peripheral modules won't heat up much at all. Using precision machines inlets jetting the coldest coolant directly at the hotest spots and allowing the coolant to flow out to the rest of the chip for tertiary cooling would increase effciency, but considering the size of modern CPU's it would require a very thin walled super high precision heat sink module form factor fitted to the CPU. The basic premise being that wherever the inlet is located is going to receive the most cooling for two reasons, one the coolant is coldest at that point, and since it has to disperse throughout the rest of the module it's also flowing extremely fast and at a high volume at the inlet point relative to the flow through the rest of the module (small inlet area high outlet area and volume it's a simple Venturi effect), if you wanted multiple inlets the fluid dynamics (and precision of construction required) would get VERY complex.