Hi,
I have been doing a project from quite some time now but have hit a interference problem, the project consists of GSM+GPS+MCU usual tracker thing.
I placed one large ground plane on both sides using a polygon pour after routing but I think this has caused a problem whereby I get interference on the 3.3v from the 3.8v supply to the GSM (in metal can), all IC's have decoupling caps and the GSM has smoothing as per manufacturers spec.
My question is, what it the best general rule for ground planes in a mixed deign like mine?
1) One ground place on both sides with more smoothing
2) two/three ground planes, power circuit, GSM, MCU
3) Run a track around outer edge on both sides
Hope someone can help, I know it's a large subject but just some guidance as to the best approach.
Thx
I have been doing a project from quite some time now but have hit a interference problem, the project consists of GSM+GPS+MCU usual tracker thing.
I placed one large ground plane on both sides using a polygon pour after routing but I think this has caused a problem whereby I get interference on the 3.3v from the 3.8v supply to the GSM (in metal can), all IC's have decoupling caps and the GSM has smoothing as per manufacturers spec.
My question is, what it the best general rule for ground planes in a mixed deign like mine?
1) One ground place on both sides with more smoothing
2) two/three ground planes, power circuit, GSM, MCU
3) Run a track around outer edge on both sides
Hope someone can help, I know it's a large subject but just some guidance as to the best approach.
Thx