Hey, does anyone know if there is such a product as a dummy BGA package where all the balls undernearth are run to test pads that sit on top of the IC? For testing the reliability of a reflow process without risking an expensive part or needing an X-ray?
EDIT: Found it. Not quite what I described but it's called a "daisy chain dummy package" where pins pairs of connections are shorted together so you can test for continuity between them rather than running each pin to the top. The pairs are connected together on PCB to produce a continuous daisy chain that you can test at the ends to determine continuity.
EDIT: Found it. Not quite what I described but it's called a "daisy chain dummy package" where pins pairs of connections are shorted together so you can test for continuity between them rather than running each pin to the top. The pairs are connected together on PCB to produce a continuous daisy chain that you can test at the ends to determine continuity.
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