Grossel
Well-Known Member
Hi forum.
This is just a resyme of experience about the use of heat gun to remove (all) components from PCB board as opposed to use soldering iron.
Summer is finally knocing on the door, most of last winter snow is gone.
So during the winter months I have collected some PCB boards from defect equipments and I've spend a couple of evenings after work to remove all components.
The pros using heat gun
Reality check - now for the cons of using heat gun
Well that is it. This is the experiences that I have made spending two evenings of mass stripping of PCB components.
Any comments is welcome - other things I havent mentioned? I would like some ideas on how to deal with sticky smell, is there a better way to prevent it to stick to air and clothes?
This is just a resyme of experience about the use of heat gun to remove (all) components from PCB board as opposed to use soldering iron.
Summer is finally knocing on the door, most of last winter snow is gone.
So during the winter months I have collected some PCB boards from defect equipments and I've spend a couple of evenings after work to remove all components.
The pros using heat gun
- Once an area on the PCB is properly heated, it's way faster than using a soldering iron.
- It almost doesn't matter how many pins a component have - it get's off because a fairly big area is heated. Just be aware where the air flow goes and use smalles possible nozzle. It's even a fairly good method that also allow you to remove ATX power adapters from computer mainboards.
Reality check - now for the cons of using heat gun
- As the air gun heats up tha PCB itself, it takes longer time before the solder melts AND the overall heated area is bic compared to using a soldering iron, meaning the components often takes more heat. Not all components is resistent to long exposure of heat. In my experience espechialy film capacitors tend to break where the pins are mounted (those that looks like sleeping pillows) and the other variant the square shaped have the problem that the plastic enclosure start to melt before the component let go. Any component that does have plastic casing may not survive, being damaged due to deformation of plastic. For that kind of components, use soldering iron first and then use heat gun to other components.
- DANGEROUS SMOKE/GASS : Using heat gun to a PCB creates a hell of a lot of smoke compared to regular desoldering with soldering iron. This smell does really stick to any clothes, hair and skin, and even after a long shower, I cannot get completely rid of the smell. To somehow compensate for that, I never do this when there is no wind, nor when the wind is shifting. Also I stand over the PCB and try to always point the air gun in same direcion as the wind blowes, and also try to point it downwards.
- Some components just won't let go (kind of same as above). When that happens - espechial big components like heavy transformers with several legs and transistors still attached to cooling ribs - it get's into a battle between me (want to get it out) and the component(s) (wan't to stick to PCB). Since I don't have the brain to just give up, it resulting in overheating of PCB, the PCB being more flexible/soft = component just get even harder to breake loose = even more heating. This results in bad smoke as something between PCB layers start to boil/melt. This was one of the first bad experience I had using this method, so I always attemt to remove smaller components first so they don't take damage of overheating.
- Electrolyte capacitors. One property that most electrolytes have in common is that it takes time from first leg get loose until the next is loose and it can be removed. It seems to be more likely to happens if the area of PCB was not heated. I did a test (have got a esd meter) on about 50 electrolytes in different sizes, and they all survived the heatgun removal method. That is - I had two old computer mainboards that both was defect - and it turned out they both had the very same electrolyte that was defect (no way the heat gun could have being the reason for that when all the others survived)
- Electrolyte capacitors (2 - not actually relevant to use of heat gun, but still need to mention). After having tested the actual capacitance/esr it turns out that for some computer mainboards, it seems that someone have cheated. Found one motherboard where every single capacitor labeled 2200uF, they all measured around 1300uF, esr around 0.2 and otherwise in good condition.
- Resistors, diodes etc: For the most part, these components survives. But : when there is an area on PCB crowded by small components like this, the problem is simply that too many of them get loose simoultanely and I can't pick them out fast enough, so there is a risk of overheating.
- Resistor bridges : I'll say that 2 of 3 is removed successfully. The last third get broken because one or more legs wouldn't let go, and the material get soft and breake apart. This may also be a problem because I haven't a decent plier that can share the load ofer the surface, so it may have failed even if I was using a soldering iron.
- DIP switches. These normally have casing of plastic. By now I have done two PCB's that contains rows of DIP switches, and the tesult varies. One PCB from early 90's that have always being located indoor, was no problem at all - all the dip switches survived (four pins pr switch). The other one had being located in a enclosure outdoor near sea for several years (mid 90's I guess) and I managed to resque 4 of 5 DIP switches. The one that failed had a very poor pin, not a problem with melting plastic. Overall experience is good.
- Communication ports (computer mainboards). For the most part, all those survives because they're just basic contact points. The main issue is some PCB boards becomes flexible when heated, results that parts with multiple pins won't let go. The bigger and heavier the component is, the bigger is the issue it seems.
- Using paperboards that have contained milk. Since some of those have a very thin plastic layer inside, some SMD components that I thrown in the box was actually stuck at the inner coating. So after twisting and pooling loose, that resulted in bad contact on the smd components surface. Hint - use metal boxes if possible.
- PCB flexing like a spring : Using hot air gun, results in pretty much melted solder on the surface on the PCB. When a component finally get loose, the PCB may flex like a spring, resulting that both soldering and other components may fall to the floor. Removing hardened solder from the floor may involve some wasted time, you may want to put cardboard on the floor to prevent that work afterwards.
- Seems that different PCB's have different heat transfer caracteristics. For most PCB's (most of moderns, like in computers) it is less work to use heat gun over soldering iron. But there is certain PCB's that is hard to work with. Had an old AT power supply board that when heated up, it flexed more than other pcb's so I had to fight to get all components out (destroyed some film capacitors on it) and troubled with overheating. It may also be caused by the manufactor had used much more soldering on it compared to other boards.
- Don't try to remove components close to vise : Some of the early lessons I made. If there is a component very close to the vise, I always struggle to get it loose and often just have to cancel because PCB overheats before the component get loose. I can only assume this is due to heat loss to the vise itself or the air flow somehow doesn't pass the PCB close to vise. This is one experience that I know, but I don't fully understand why it behaves this way.
- Bonus lesson (1) : components that won't get loose. If a component refuse to get loose, most of the times it can be solved by moving the hot air gun so that it aim the air flow at the oposite side of the PCB.
Well that is it. This is the experiences that I have made spending two evenings of mass stripping of PCB components.
Any comments is welcome - other things I havent mentioned? I would like some ideas on how to deal with sticky smell, is there a better way to prevent it to stick to air and clothes?