The moisture sensitive nature of some parts is also a problem when the board is to be soldered in a reflow oven. What happens is the moisture will get into the package where the metal parts (pins, heat sinks, etc.) are molded into the plastic body. When the parts go into the oven to be soldered, the moisture will turn to steam, create pressure and crack the case, damaging or destroying the part. It's very similar to the moisture expanding in popcorn (which literally turns the kernel inside-out), although to a less spectacular degree. I wouldn't worry about it unless you plan to solder the boards in a reflow oven.
JB