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Damage to PCB/components due to encapsulation

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Richard Mackay

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I was skeptical at first but with fast setting potting compounds I have found stresses are caused which can cause damage to tracks/components.
Unsurprisingly it is difficult to establish where damage occurs and how to avoid it.
My suspicion is that it's where components are restricted from moving. e.g. LEDs protruding through holes in lids..
Has anyone had similar experiences?
 
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