A normal temperature-controlled soldering iron and a dental pick. Put lots of solder on the iron tip, then touch it on two contacts at the same time, and with the dental pick under the component apply a SMALL amount of upward pressure. The component will tilt very slightly and you will get a fraction of a mm lift on that side.
Then repeat on the other side, lifting that side. Repeat both sides 5 or 6 times and it will be lifted 1-2mm. That is enough to get a solder sucker near it and suck out the solder in each pin in turn, so the component falls off.
It sounds complicated but the whole process only takes less than a minute and won't heat or cause issues with the other components.