Specifying Holes Pads Vias in Diptrace

In Diptrace, you can specify pad and hole properties in the pattern, but also within Via Styles in the PCB Layout. What's the difference between the two and which one takes priority?

Also, does the term "via" refer to the physical drilled hole, the inner diameter after plating (assuming TPH), or the outer diameter of the pad, or is it a generic term for all of these?

Thanks to the community for the help.