MrDEB
Well-Known Member
I read with great interest about soldering SMD using a fry pan with a plate of aluminum under the pc board to distribute the heat.
BUT they talk about using paste flux with balls of solder within the paste. needs refrigeration and overnight deliverly.
My thought was to glue the componets using a dab of glue (Arlienes craft glue) then laying alayer of rosin flux on pins etc.
THEN using thin solder , smash the solder flat(more contact for heat absorption?) then cut lengths to go across the pins of say a SSOP-18.
heat in fry pan until solder melts. remove from heat and cool.
I am going to try this out but using a dip-18 (I have a fried PIC-got Vcc reversed)
curious if anyone has tried this??
BUT they talk about using paste flux with balls of solder within the paste. needs refrigeration and overnight deliverly.
My thought was to glue the componets using a dab of glue (Arlienes craft glue) then laying alayer of rosin flux on pins etc.
THEN using thin solder , smash the solder flat(more contact for heat absorption?) then cut lengths to go across the pins of say a SSOP-18.
heat in fry pan until solder melts. remove from heat and cool.
I am going to try this out but using a dip-18 (I have a fried PIC-got Vcc reversed)
curious if anyone has tried this??