I find via's to be fairly easy, but I use paste and a hot air station. They are certainly a hell of a lot easier than any plating technique I've seen.
Many components, like the DIP's you can solder either the top or bottom side, so there's no real need to move the trace to the bottom unless you are using a socket. I've also soldered the top side of headers. You can slip the plastic part of the header up and down the pin. Hard to explain, but these headers have all been soldered on the top side.