OutToLunch
New Member
D2Pak FETs have worked very well for passing large amounts of current straight to the pcb. There is also the added benefit of heatsinking directly into the copper on the board.
If you do go forward with it, I would suggest that this would work with 4 layers of 2oz copper (six layers would be better but more expensive). Top and bottom layers are used for power and signal. Don't make power traces, make large copper polygon areas. Second layer should be ground and ground only - no other traces or power planes at all. All component ground connections should come from the pin on a wide and VERY short trace to a via. Power connections should use multiple vias. Third layer should be power - input power and output power.
For a six layer board, the Top and Bottom layers are the same - power and signal. Second layer and fifth layer should be dedicated ground planes. Middle two layers would be power planes.
If you do go forward with it, I would suggest that this would work with 4 layers of 2oz copper (six layers would be better but more expensive). Top and bottom layers are used for power and signal. Don't make power traces, make large copper polygon areas. Second layer should be ground and ground only - no other traces or power planes at all. All component ground connections should come from the pin on a wide and VERY short trace to a via. Power connections should use multiple vias. Third layer should be power - input power and output power.
For a six layer board, the Top and Bottom layers are the same - power and signal. Second layer and fifth layer should be dedicated ground planes. Middle two layers would be power planes.