I have not done a SC-70, but I have done a TSSOP-14 , which has the same 0.65 mm pin spacing. There was really no problem at all.
What size pads did you use? Mine were 0.012"x 0.039" (Eagle, approx. 0.305 mm x 0.991 mm). In other words narrower than on the MCP link you provided. Did you omit soldermask between the pads? Mine were soldermask defined (no central heat sink). I used leaded 63/37 solder.
Finally, for solder braid, I only use Chemtronics Rosin SD "Solder-Wick." I have tried other brands but have not been as satisfied. It will almost remove the very thin solder plating to reveal copper.
John
EDIT:
I figured a couple of images might help.
Here is the board from the Purple People:
Millimeter scale at bottom. NB: solder resist
Here is the soldered device (AS5048):
Sorry for the glare. It is the best I can do with my cheap photo"microscope" (Andonstar).
John