Makaram
Member
https://i.imgur.com/hhSIIlZ.jpg
Link to picture showing all 4 layers.
This is my first attempt at 4 layer pcbs and would like some expert advice.
E.g. hows that pour stitching looking? Too little? Do I need the top and bottom ground planes?
The circuit is essentially a RN42 bluetooth modules, a pic32mx220f032d, a buck regulator and an H bridge hopefully capable of up to 15A @ 12v.
As for EMI reduction I've got a ferrite bead and 1nF bypass cap feeding the 3.3v plane for my mcu and all the RF stuff is handled by the RN42 module.
Thanks for any advice you guys can provide.
Link to picture showing all 4 layers.
This is my first attempt at 4 layer pcbs and would like some expert advice.
E.g. hows that pour stitching looking? Too little? Do I need the top and bottom ground planes?
The circuit is essentially a RN42 bluetooth modules, a pic32mx220f032d, a buck regulator and an H bridge hopefully capable of up to 15A @ 12v.
As for EMI reduction I've got a ferrite bead and 1nF bypass cap feeding the 3.3v plane for my mcu and all the RF stuff is handled by the RN42 module.
Thanks for any advice you guys can provide.