when making traces for large current problem is cross section of traces.
the larger the cross section, the more current can flow through it.
usually very wide traces are not practical so possible workarounds for example are:
1. use of multiple layers (note that inner layers are worse for this because of limited cooling). layers need to have equal current carrying capacity and have plenty of vias for better contact near component terminals. if the traces or tracks are not even, there should be more vias, possibly along entire track.
2. use thicker copper cladding (standard may be 1oz of Cu per square foot but you can get 2x, 3x or 4x that if you specify it)
3. leaving slots in soldermask along PCB tracks and applying some solder (like "mountain range") to increase cross section.
4. optionally don't place high current conductors on pcb, use other methods for those circuits (wires, bars, ...)
5. also check needed clearances between tracks due higher voltage. if the board has proper coating, clearances between tracks can be reduced.
examples:
before - **broken link removed**
after - **broken link removed**
note that even light coat of solder dramatically changes thickness of the pcb traces.