I would like to add an observation... the blob all pins method, then use desolder wick, works, but may severly stress the IC heat wise.
I frequently work on tiny IC's with pin pitches of 0.5mm, but tend to stay away from applying solder directly.
The trick I use is to pre-tin the pads with a small amount of solder, spray the pads with solder-flux laquer, (Kontakt-Chemie SK10) locate the ic, then solder the pins with a 'clean' iron tip only, reflowing the existing solder. This avoids any bridging, as flux has been pre-added, dry joints don't happen.
As I do this type of soldering a lot in my company, for prototyping, I had to invest in a pretty cool soldering station (Metcal) which uses RF to heat the tips, plus for SMD work use, I mainly use 0.4mm tips. These units are very expensive though, (£350, with no tips) used by the likes of NASA etc. I used to use Weller stations, but they don't even come near to the Metcals in performance & power. The aforementioned 0.4mm tip warms up, and melts solder in 3 Seconds :shock: from stone cold.
Yup, I realize, not many hobbiests are likely to have Metcals, but even with normal irons, the above method should still get good results.
It is possible to file down standard iron tips to thin rectanglular point to achieve similar results, using the pre-tin method, allowing single-pin re-flowing.
Just a few ideas that maybe helpful?
Steve