Hi,
Thank you for your explanation about how to define the maximum pull-up resistor value. If I correctly understood:
R_pull_up < minimum_gate_threshold_voltage / maximum_gate_body_leakage
R_pull_up < VGS(th) / IGSSF
And for this case (from FDG6332C datasheet) :
minimum VGS(th) = 0.6V
maximum IGSSF = 100nA
Then R_pull_up < 0.6/100nA => R_pull_up < 6M
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In answer to your question about load current, the final load is gonna be a uC from TI (MSP family) and a micro-motor. When uC in sleep mode, the load current is around 500nA. And when fully operational the load current is around 13mA.
But for validation, I mean for the tests (related to this post) I did so far, I used R_load = 220k => I_load = 14uA.
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To make sure the FDG6332C are not defective, I did the test_#2 and test_#3 twice with 2 different FDG6332C.
In fact, on one FDG6332C I assembled 3 small wires and pull-up resistor (4M7) directly to the device pins, and with the other one, I assembled the FDG6332C and pull-up resistor on a pcb. Then I did test_#2 and test_#3 for both cases.
Do you think I could have
partially damaged both FDG6332C with a bad manipulation? I mean partially, because when using a 220k pull-up resistor both devices seem to work (test_#3). Or any other reason?
As FDG6332C package is smaller than FDC6327C, I really wish a could use the FDG6332C. This is why I keep on trying to understand the reasons of difference.
Any advice will be really appreciated.
Stephane