Hot air rework, blisters on PCB?

I'm trying to repair a PCB and I've been a bit too aggressive using my hot air rework station. The PCB has formed "blisters" that crack and seep out black fluid (which I have no idea what is).

Did I destroy the PCB, or are the traces inside probably still intact? I don't know how many layers the PCB has.

halleffector said:

The PCB has formed "blisters" that crack and seep out black fluid

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Its the resin in the FRC board.. I sometimes get a bit of melted resin when I resolder... A little is kinda normal.

halleffector said:

Did I destroy the PCB, or are the traces inside probably still intact? I don't know how many layers the PCB has.

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Not necessarily! You will need to run continuity tests... You can always run external wire to bridge any broken tracks..