anso-engineer
Member
Hello, I have an old question which makes me curious... Which temperatures are for:
1) Separating phone screenes from frame
2) Removing phone back covers
I am spekaing mostly about chinease brands, Xiaomi, Meizu, Huawei etc. They has IPS and AMOLED screens and plastic covers.
In most of dissasembiling guides it shown as heating up to 80° in general... I suppose that B7000 has melting poing about 85° C.
Theoretically, putting your phone on Separator machine, set there 80° C and heat for a 3mins should be enough for cover and screen...
I saw that someone also used heating gun from soldering station, with 300° C during 2-3 mins.
1) Separating phone screenes from frame
2) Removing phone back covers
I am spekaing mostly about chinease brands, Xiaomi, Meizu, Huawei etc. They has IPS and AMOLED screens and plastic covers.
In most of dissasembiling guides it shown as heating up to 80° in general... I suppose that B7000 has melting poing about 85° C.
Theoretically, putting your phone on Separator machine, set there 80° C and heat for a 3mins should be enough for cover and screen...
I saw that someone also used heating gun from soldering station, with 300° C during 2-3 mins.