Modern surface mount placement adhesives are designed to be placed by stencil, worked at room temp, and for standard adhesives, cured at anywhere between about 100-180 degrees for a couple of mins in a curing oven.
Pretty much all of them are designed with a known themoplasticity that allows easy breakage when re-heating above 200 degrees, either with hot air tooling or infra-red.
What does tend to cause some problems, is when the rework rig, both hot air and infra-red suffer equally in this respect, is not set up correctly, does not properly pre-heat a board and step through the temperature ramping at the correct intervals or for long enough etc. This leads to solder balls melting at different rates in the cycle, and if the device is pressured to lift off early, can lead to pad damage. Adhesive dots under very large devices can sometimes suffer from the same problems, not be heated fully, and therefore will not break cleanly when expected, but this has nothing to do with the adhesive properties or the tooling used, it's the process that's flawed in some way.