thermal

hello, I have question about junction temperature. I thermal simulated the chip (CPM2-1700-0045B, CREE) in LTspice. However, I do not understand because it is very different from the chip (C3M0045065D, CREE) result. The result of the chip (C3M0045065D) is that the heat gradually increases and...

i see "thermal conductive paste" on ebay, but i suspect that's just heatsink compound. **broken link removed** i need high mechanical strength. thx!

Looking for thermal resistance in the LM317 datasheet from TI, I found something which doesn't make any sense to me. https://www.ti.com/lit/ds/symlink/lm317.pdf Page 4 There're two TO220 packages, which seem differ in the thickness of the tab. One of them is 4.2 ºC/W junction-case, which is...