surface mounting DIP/DIL package? - Electronic Circuits Projects Diagrams Free

dalmation · 16th October 2007, 01:33 PM

Does anyone have a tried and tested technique for surface mounting DIP/DIL packaged IC's?

I was gonna bend the pins out or under and give it a try. I might even bend then over and mount the chip upside down for one particular circuit where the pinout would be much better 'mirror image'. I know it sounds daft, but I have my reasons.

Anyone had any experience of this madness?

Thanks in advance.

-Dalmation.

ericgibbs · 16th October 2007, 01:38 PM

Quote:

Originally Posted by dalmation

Does anyone have a tried and tested technique for surface mounting DIP/DIL packaged IC's?

I was gonna bend the pins out or under and give it a try. I might even bend then over and mount the chip upside down for one particular circuit where the pinout would be much better 'mirror image'. I know it sounds daft, but I have my reasons.

Anyone had any experience of this madness?

Thanks in advance.

-Dalmation.

I have used DIP ic's with legs bent at right angles, works fine.
You can crop the pins/legs to shorten them if space is tight.

Never used the method for upside/down mounting.

CAUTION: the legs will break off, if repeatedly bent to and fro.

ronsimpson · 16th October 2007, 02:02 PM

IC socket: Through hole to SMT.

dalmation · 16th October 2007, 03:46 PM

I'll experiment tonight (with the cheapest IC's I can find).

I'll also try converting some of my sockets into SMD.

The upside down thing might be a bit ambitious, but I'm gonna try it anyway.

I'll post pictures if I get good results.

-DAlmation.

Carl W. Livingston · 16th October 2007, 07:57 PM

I've bent the legs under the DIP package with success. You need to trim the leads back a bit so they don't touch any traces running under the IC.

It worked good for me.

dalmation · 16th October 2007, 09:55 PM

I had a wee go there.

Bent the bottom half of the legs outwards (90 degrees), then trimmed them back with snips (using a credit card as a spacer to leave a 1mm 'foot'.

Looks just like a SOIC chip now. It makes the chip footprint quite wide, so I'll try bending under the chip as well.

-Dalmation.

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16th October 2007, 01:33 PM	(permalink)
dalmation	surface mounting DIP/DIL package? Does anyone have a tried and tested technique for surface mounting DIP/DIL packaged IC's? I was gonna bend the pins out or under and give it a try. I might even bend then over and mount the chip upside down for one particular circuit where the pinout would be much better 'mirror image'. I know it sounds daft, but I have my reasons. Anyone had any experience of this madness? Thanks in advance. -Dalmation.

16th October 2007, 03:46 PM	(permalink)
dalmation	I'll experiment tonight (with the cheapest IC's I can find). I'll also try converting some of my sockets into SMD. The upside down thing might be a bit ambitious, but I'm gonna try it anyway. I'll post pictures if I get good results. -DAlmation.

16th October 2007, 07:57 PM	(permalink)
Carl W. Livingston	I've bent the legs under the DIP package with success. You need to trim the leads back a bit so they don't touch any traces running under the IC. It worked good for me.

16th October 2007, 09:55 PM	(permalink)
dalmation	I had a wee go there. Bent the bottom half of the legs outwards (90 degrees), then trimmed them back with snips (using a credit card as a spacer to leave a 1mm 'foot'. Looks just like a SOIC chip now. It makes the chip footprint quite wide, so I'll try bending under the chip as well. -Dalmation.