I understand how this process works, it's simply not feasible in my case. Total count of ICs that require heatsinking at the moment are about 20. Mostly power MOSFETs. Each of which have non-insulated metal tabs that require an insulating thermal pad. I have a single large PCB (for cost reasons) and a single large heatsink (again, cost reasons). This is a 10" x 6" heatsink, and I'd like to be able to spread out all the ICs across it for better heat dissipation. I have no doubt that this would lead to a much cleaner layout and help a ton when it comes time for me to modify/add to the PCB (which is likely to happen frequently). Both the LME49830s and LM3886s also have quite odd pin spacing that prohibits easily inserting them into a .1" pitched PCB.
Either I have a bunch of PCBs with wires running between them, or I have a bunch of wires running from the HS to my PCB.
Thanks for the suggestion though. What I'd really like to know is if anyone has a better idea of how to solder leads to my ICs. It's completely doable with bare wires, but I was wondering about better ways.