Ic Package's Die Of QFP And TSSOP Are Different?

mailrapid

New Member
**broken link removed**

Why DIE of QFP is at the middle center(blue circle)?
Why DIE of TSSOP is at the bottom(blue circle)?

Is there any advantage or disadvantage?
 
mailrapid said:
**broken link removed**

Why DIE of QFP is at the middle center(blue circle)?
Why DIE of TSSOP is at the bottom(blue circle)?

Is there any advantage or disadvantage?

I can't say for sure.. however, I do know that some TSSOP packages also come with a heatsink pad on the bottom of the part to facilitate heat removal. Perhaps that has something to do with it.
 
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