total bs - there are so many problems with it. Just to state a few - if you've ever taken the heatsink off of a processor, you'll know that it's not as easy as just lifting it up. There are mechanical hold downs. Plus the thermal grease can act as a glue, making it hard to pull off when the mechanicals are removed.
I've seen a lot of exploding ICs - all of them blew in very high power supplies. They do nothing like was shown. If an IC is gonna blow, the package will blow out and expose the die, but not with enough force to blow everything apart.