data sheet interpulation

[Joe G]

could someone interppret this for me, i'm have a bit of a brain cramp and just can't figure
it out. thank you

 

[vne147]

could someone interppret this for me, i'm have a bit of a brain cramp and just can't figure
it out. thank you

View attachment 39556

At first glance it looks like it is a graph that relates the size of a PCB pad used as a heat sink to the IC temp and power dissipation capability. Can you post a link to the entire data sheet?

 

[Mike odom]

At first glance it looks like it is a graph that relates the size of a PCB pad used as a heat sink to the IC temp and power dissipation capability. Can you post a link to the entire data sheet?

lower curve gives you thermal resistance, read off the left, where upper curve gives you power dissipation, read on the right.

what it's telling you is the maximum power you can dissipate in this package for a given copper heatsink size. Make sure you don't mask over the copper, and if you can, put another on back with lots of vias connecting the two...

 

[Joe G]

i wasn't sure what line ment what, thanks. also here is the link to the data sheet.

https://www.electro-tech-online.com/custompdfs/2010/02/NCP1117-DPDF.pdf