Wider pads will generally make soldering easier. The pad in your second thumbnail looks too small to my eye, there is a risk of damaging the pad whilst soldering if it is too small.
The pour in your first image is odd, there is no particular reason to leave a big pour under the resistor pad. I do not understand there is a gap in your power polygon in the third picture. It would be better to have a solid pour and then extend a trace from the edge of it to your pin. Or just expand the whole pour down to your IC.
I recommend you either use traces (and decent sized pads) throughout or run a big polygon pour to create a power plane.