The only "problem" I have observed using lock footprints is finding out some months after soldering a board together was when I was unpluging a connector and the header came off the circuit board – I had missed soldering it, and it was working well despite that omission. This "problem" can be handy for making temporary connections like an ICSP header. Insert a header during dev, then remove it when you're finished.
I have to question your "gas tight" point as well. These headers have square pins, just like wire-wrap headers and sockets. The very slight interference fit created by a lock footprint causes the header pins to slightly score into the hole plating.... if you believe claims about wire-wrapping, the sharp corners of the pins bite into the wire, creating a gas tight connection. Hmmm. A lot of complex (i.e., hundreds if not thousands of connections) of gear with wire-wrap connections is still going strong, so maybe they knew what they were talking about.
The Sparkfun article documents the efforts made to determine and test the optimal spacing. It was pretty well researched, and Sparkfun has been using it for years.
I'm not here to debate the idea. I have found it useful without any problems. Please feel free to use it or not as you see fit.
Of course, one has to wonder how many headers you unsolder that this would be a major concern......