Ic Package's Die Of QFP And TSSOP Are Different? - Electronic Circuits Projects Diagrams Free

mailrapid · 21st December 2007, 03:25 PM

http://hotimg15.fotki.com/a/124_8/21...-and-TSSOP.jpg

Why DIE of QFP is at the middle center(blue circle)?
Why DIE of TSSOP is at the bottom(blue circle)?

Is there any advantage or disadvantage?

Optikon · 21st December 2007, 05:24 PM

Quote:

Originally Posted by mailrapid

http://hotimg15.fotki.com/a/124_8/21...-and-TSSOP.jpg

Why DIE of QFP is at the middle center(blue circle)?
Why DIE of TSSOP is at the bottom(blue circle)?

Is there any advantage or disadvantage?

I can't say for sure.. however, I do know that some TSSOP packages also come with a heatsink pad on the bottom of the part to facilitate heat removal. Perhaps that has something to do with it.

mailrapid · 23rd December 2007, 03:53 AM

Thanks.
But how does QFP dissipate heat because of its die at the center?

felis · 23rd December 2007, 04:21 AM

Maybe it won't produce that much heat?

21st December 2007, 03:25 PM	(permalink)
mailrapid New Member	Ic Package's Die Of QFP And TSSOP Are Different? http://hotimg15.fotki.com/a/124_8/21...-and-TSSOP.jpg Why DIE of QFP is at the middle center(blue circle)? Why DIE of TSSOP is at the bottom(blue circle)? Is there any advantage or disadvantage?

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23rd December 2007, 03:53 AM	(permalink)
mailrapid New Member	Thanks. But how does QFP dissipate heat because of its die at the center?

23rd December 2007, 04:21 AM	(permalink)
felis Experienced Member	Maybe it won't produce that much heat?