Electronic Circuits and Projects Forum

I should have asked before, are you using Eagle 5.11 (or any 5.xx) or 6.0/6.1? I assume there is backward compatibility, but there is no need to make it more complicated than needed. I have both versions.

John

Edit: One more detail. will the solder paste stencil be 150 micron or 110 micron thick? The pads at 110 micron are 2.36X0.7 mm and at 110 micron are 1.75X0.7 mm. The thicker stencil allows more solder paste, so adjustment is apparently made in the pad length. My guess is that a bigger pad with a thicker stencil might lead to shorts. (The only LGA similar type device I have done was an accelerometer that I hand soldered...it only had 8 pads.)

I have a draft with the shorter length. Changing to the longer length is not a problem. Notice the spacing around the RF pad is a little different. Again, that can be dealt with. I ended up using two grids (1.2 and 1.0) with a minimum of 0.05 to accommodate the RF pad. (I may change my mind on that depending on the "BIG" problem described below.)

There is one BIG problem, as best I can see it. The drawing is not fully dimensioned. The inner ground pads were easy to do, because the corner distance (i.e., C/L horizontal to C/L vertical) is shown. It is 2 mm. I cannot find any way to relate the vertical outer pads to the horizontal outer pads.

If you can find it (no guessing!), let me know. I was following the recommended pattern(s) in Figures 45 and 46. I just reread it. I will redo according to Figure 44, which is fully dimensioned, and leave the stencil until later.

John

I have a rough draft of the package to send you. There are a few additions I will need to make after reading the data sheet some more. It will probably be best if I also make the symbol and connect the pins too. If you have already made the symbol, please post it here. Since I had started with Eagle 5.11, I stayed in 5.11 for this draft. I plan to convert everything to 6.0/6.1 for the final device. 6.1 has a nice tool for measuring, which will make checking the dimensions much easier than doing it the 5.11 way.

I have never tried to send single devices from a library. So, let's see how this works. I made a separate library called TempETO. You will want to make your own personal library, if you have not done that already.

I zipped the file, since .lbr is not supported here. You will need to unzip and copy to your Eagle library. In XP, you can probably just move it using explorer. Alternatively, within Eagle, you can use Control Panel to make a new library.

Eagle has some ways to copy libraries, but I am rusty at that. I usually just open the object, select all, cut (or copy group for 6.1). Then in library mode, click on package and enter the new package you want to transfer. Eagle will not find it and will ask if you want to create a new package. Click yes. You will get a black screen. Under View, select grid, and make it what you want. In this case, make it 1mm for major (count =1) and 0.05 mm for minor. Then paste.

As mentioned, I used two grids (1.0 mm and 1.2 mm with the minor at 0.05 for both) . In general that is a bad idea with Eagle. However, in this case, the 1.2 mm grid made it easy to get the signal pads centered. Since the fine divisions were the same, it did not create a problem.

Now let's assume you forget to change the grid before pasting. The default will probably be in inches. There is no way you will easily get this package to line up with that grid. Play with it, if you want. But then just delete and start over with the proper grid.

I named the package LGA66 for the number of pins. If there is another name you prefer, let me know.

What is your time frame for getting this done? Depending on weather, I have some outside chores that must get done if it doesn't rain. In that case, I won't be able to get back to this until tomorrow afternoon. I am on Eastern Daylight time, USA (GMT-5?).

John

PS, Those extra lines in Dimension layer were used as drawing aids. They will be deleted in the final version.

TempETO.zip