6th March 2012 01:10 PM
Excuse me. Then how about this one? Now "the piece of copper on the right between the three pads and the trace“ is connected to other thing. It should be there but there is still a too thin line in the pour copper.
6th March 2012 01:31 PM
I would just increase the isolation distance, it could be set to 8 mil now, so increase it to 10mil and those two thin lines should disappear. Then you should add a via to the remaining piece of copper to connect it to something or it should not be there at all.
6th March 2012 01:44 PM
If that comment is in response to my comment immediately above, then NO, I am not talking about the cross-hatch or lines fill (not available on Eagle) options. If you think of the fill as a vector rather than bit map, the fill is with lines that touch. The thicker the line, the more jagged will the edges be. The thinner the line, the more processing it takes. Eagle used to have a warning to that effect. Line width does not affect the gross appearance of the filled areas in Eagle, unless you pick the cross-hatch option.
Originally Posted by PCBWING
Just to clarify, there are multiple ways to do what you asked in your first post. Your later post on page 2 illustrates one of the problems of using isolate as the variable. Of course, you can avoid that by using multiple polygons. The restrict method avoids that too, and I find it easier to do in a controlled and precise manner. In Eagle, isolate and line width can affect other things too, like the the way thermals are made.
Finally, as to the patch of copper that is not connected to anything, that is called an "orphan" in Eagle. You can choose to have them left in place or removed.
BTW, Are you actually a PCB manufacturer or is that just an avatar you like?
7th March 2012 02:19 AM
Okay,I know your meaning: There should be a fit distance to set. Thanks, kubeek.
Last edited by PCBWING; 7th March 2012 at 02:20 AM.
Reason: I input a Chinese" ，"
7th March 2012 02:40 AM
Thanks for your reply. I can know in Eagle there would be some set options for it. In PCB plants like us, the "orphan" was given the name "Island".
Originally Posted by jpanhalt
Yes, I'm working in PCBWING.com which is a online PCB manufacturer. But this is not an AD, at least before I become to a supporter of this "electro-tech-online" forum. Also we do not send Spam. I‘m here to make new friends, and also hope to maintain contact with the circuit professional technical personnel. Thank you very much.
7th March 2012 10:08 AM
I do like the tear-drop shaped pads you are using. Prior to version 6.x, that was not possible with Eagle. It might be with the new versions, but I haven't tried.
One thing to consider when using "isolate" to prevent the thin lines is that you may cure the problem is one area and create another somewhere else, particularly on complex PCB's. Using a restrict layer will not have that global effect.
7th March 2012 10:55 AM
Yeah, the tear-drop pads are useful. I saw many designs use it. If designers use the old version software, they could request the PCB house to add it. But it should be they done the copper pour before. Otherwise it would happen short circuit. Like this.
Originally Posted by jpanhalt
7th March 2012 07:43 PM
8th March 2012 01:07 AM
Thanks for your "Hi" and so a many faces. I am worried that you did not understand the drawing. I do not think everyone agrees that these posts are useless. In many designs, there is not enough space for designers to draw a straight line, like this.
Originally Posted by Boncuk
8th March 2012 01:30 AM
In addtion, curve is useful. I believe that it would be better if electrons run in a smooth curve.
Curve & No space.gif
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